10:1 High Transparency Mold Silicone

Hong Fenghao 10:1 High Transparency Mold Silicone Transparent adhesive for making crystal drill molds. Product from: Dongguan Hong Fenghao Technology Co., Ltd. Contact: 13711884298 Wu Haiping, Technical Consultant: 13058520516 Wang Zhanfeng, Exclusive: Hong Fenghao Silicone Wu Haiping, providing silicone technology application solutions for you. Resin drill mold silicone, simulated drill mold adhesive, crystal imitation gemstone mold silicone, imitation zircon mold silicone, crystal resin drill silicone, faceted drill silicone, and polyester, polyurethane, resin silicone faceted drills, rhinestone accessories, amber, imitation crystal accessories, imitation agate, jade, ring jewelry, precision casting molds.

Hong Fenghao 10:1 High Transparency Mold Silicone Description:
Resin drill mold silicone simulated drill mold adhesive crystal drill silicone imitation diamond mold silicone is a two-component addition-type liquid silicone rubber, featuring good dimensional stability and excellent demolding properties, with heat resistance up to 250°C or above, widely used for rapid prototyping of gemstone molds. Commonly used for mold making to cast epoxy resin, polyester resin, polystyrene, vinyl plastic, paraffin, low melting point alloys, concrete, etc., also used for replication and duplication of art crafts. 

Hong Fenghao 10:1 High Transparency Mold Silicone Usage Method
1. Mixing: Mix base gel and curing agent in a weight ratio of 10:1. Mixing can be done manually or with equipment.
2. Degassing: The mixed adhesive should be degassed before pouring into the mold. For small amounts, it can be done in a vacuum desiccator. Under vacuum, the volume of the adhesive can increase by 4-5 times (foaming), so the container for degassing should be 4-5 times larger than the adhesive volume. After a few minutes, the adhesive volume returns to normal. When no bubbles escape from the surface (about 10 minutes), it is complete.
3. Surface Treatment: The mold surface or the surface of the material to be encapsulated that the adhesive will contact can be treated with liquid paraffin or other release agents.

4. Curing and Demolding: Place the mixed and degassed adhesive in an oven at 120±5°C for 30 minutes to cure, or at 60-70°C for 2-3 hours to cure. Room temperature curing time is 24 hours. The curing temperature and time can be adjusted according to process conditions.